低含氧量银铜焊料的研究

材料科学论文编号:CL117  论文字数:14714,页数:26

目   录
中文摘要......................................................................Ⅰ
英文摘要......................................................................Ⅱ
第一章  绪论...................................................................1
 1.1  研究的背景...........................................................1-2
 1.2  本次研究的内容和意义．．．．．．．．．．．．．．．．．．．．．．．．．．．．.....2
第二章  钎料及钎料加工工艺.....................................................3
 2.1  钎焊的方法和原则.......................................................3
 2.2  钎料的构成及分类.....................................................3-4
 2.3  钎剂、钎料的选择与搭配................................................4-6
 2.4  钎焊工艺的研究.......................................................6-8
第三章  银铜焊料低含氧量的制粉设计.............................................9
 3.1  快速凝固技术-粉末冶金技术的发展概况....................................9
 3.2  快速凝固技术-双流雾化法.............................................9-11
第四章  低含氧量银铜焊粉BAg72Cu...............................................12
 4.1  低含氧量银铜焊粉的概述................................................12
 4.2  低含氧量银铜焊粉BAg72Cu的研制......................................12-14
 4.3  低含氧量银铜焊粉BAg72Cu的性能测试及微观分析........................14-16
第五章  低含氧量银铜焊粉在陶瓷与金属焊接中的应用..............................17
 5.1  陶瓷焊接的概述........................................................17
 5.2  陶瓷与金属的钎焊工艺...............................................17-20
 5.3  氧化物陶瓷与金属钎焊连接过程..........................................20
第六章  结论..................................................................21
参考文献......................................................................22
致谢..........................................................................23

 摘要
 
 银铜焊料是Ag-Cu二元合金的共晶组织成分，其熔点适中，工艺性好，并具有良好的强度、韧性、导电性、导热性和抗腐蚀性，在电真空开关、断路器、陶瓷焊接等方面都极具应用性。
 本文对低含氧量银铜焊料的润湿性及溅散性进行了分析，并对制粉工艺进行探讨，并通过其在陶瓷工业上的应用，对其性能进行了详细分析。

关键词：银铜焊料 润湿性 溅散性 陶瓷 制粉工艺

Abstract

 Ag-Cu filler is a binary alloy Ag-Cu eutectic composition. Silver-based filler has medium melting point, with good technology, good strength, toughness, electrical conductivity, thermal conductivity and corrosion resistance. Especially for the highly application in the power vacuum switcs, circuit breakers, ceramic welding,ect.
 This passage puts forward the impact of oxygen levels in Ag-Cu filler on wettability and sputter of filler, and explore to Manufacture of powder technology，through its application in the ceramic industry，We get the detailed performance analysis. 

 Key Words: Silver-based Filler；Wettability；Sputter；Ceramics ；Manufacture of Powder Technology