ABSTRACT
This paper presents chip multi-layer ceramic capacitors (MLCC) are widely used in computers, mobile telecommunications, household appliances, and other fields. MLCC With the continuous expansion of market demand, the ceramic capacitor technology innovation are continuously under way. In recent years, MLCC technology focused on the development of products, high-capacity, high-pressure, base metals, and function of small, and so on.
The requirements of modern MLCC, is to reduce costs under the conditions of the limited space within the medium to produce ceramic capacitors high hematocrit. In this paper, MLCC on the basis of the design, by optimizing the flow extension of ceramic membrane technology to improve performance, used in printing the appropriate electrodes in the drying temperature, the appropriate use of laminated after the drying process, a reasonable row of plastic sintering system and electroplating process to improve Chip multi-layer ceramic capacitors of the electrical properties. As insulation resistance in the chip multi-layer ceramic capacitors in the electrical properties of a more representative and thus, the issue focused on the preparation of multi-layer ceramic capacitors chip insulation resistance of the impact, the major research-extension process, printing, drying , Pai plastic, sintering, and electroplating process, such as the impact of the insulation resistance. The results showed that optimize the flow extension of ceramic membrane technology to improve performance, used in printing the appropriate electrodes in the drying temperature, the appropriate use of laminated after the drying process, a reasonable row of plastic sintering system and electroplating process can effectively improve the microwave MLCC Insulation resistance.
